- PII
- 10.31857/S0033849424070067-1
- DOI
- 10.31857/S0033849424070067
- Publication type
- Article
- Status
- Published
- Authors
- Volume/ Edition
- Volume 69 / Issue number 7
- Pages
- 648-655
- Abstract
- In this work, results of development of a W-band O-type traveling-wave tube with sheet electron beam are presented. The staggered double-grating slow-wave stricture with wideband input/output coupling structures was designed and optimized and its high-frequency electromagnetic parameters were calculated. The results of 3D particle-in-cell simulation of beam-wave interaction in the TWT are presented. Gain over 30 dB in the 25-GHz frequency band was obtained. A sample of an electron gun with an impregnated cathode, focusing electrode, and anode, providing the formation of a sheet electron beam with a high-aspect ratio and a current of 0.1 A, was designed and fabricated. The design of the vacuum window is presented, and the technology of its fabrication is discussed.
- Keywords
- миллиметровый диапазон лампа бегущей волны замедляющая система сдвоенная гребенка электронная пушка ленточный электронный пучок
- Date of publication
- 16.09.2025
- Year of publication
- 2025
- Number of purchasers
- 0
- Views
- 21
References
- 1. Григорьев А.Д. Терагерцевая электроника. М.: Физматлит, 2021.
- 2. Zhang X.-C., Xu J. Introduction to THz Wave Photonics. N.Y.: Springer, 2010. https://doi.org/10.1007/978-1-4419-0978-7
- 3. Rieh J.-S. Introduction to Terahertz Electronics. N.Y.: Springer, 2021. https://doi.org/10.1007/978-3-030-51842-4
- 4. THz Communications. Paving the Way Towards Wireless Tbps / Eds T.Kürner, D.M. Mittleman, T. Nagatsuma. Springer Series in Optical Sciences. V. 234. N.Y.: Springer, 2022. https://doi.org/10.1007/978-3-030-73738-2
- 5. Paoloni C., Gamzina D., Letizia R. et al. // J. Electromag. Waves Appl. 2021. V. 35. № 5. P. 567. https://doi.org/10.1080/09205071.2020.1848643
- 6. Shin Y.M., Baig A., Barnett L.R. et al. // IEEE Trans. 2011. V. ED-58. № 9. P. 3213. https://doi.org/10.1109/TED.2011.2159842
- 7. Baig A., Gamzina D., Kimura T. et al. // IEEE Trans. 2017. V. ED-64. № 5. P. 2390. https://doi.org/10.1109/TED.2017.2682159
- 8. Karetnikova T.A., Rozhnev A.G., Ryskin N.M. et al. // IEEE Trans. 2018. V. ED-65. № 6. P. 2129. https://doi.org/10.1109/TED.2017.2787960
- 9. Shin Y.-M., Stockwell B., Begum R., et al. // IEEE Trans. 2023. V. ED-70. № 6. P. 2738. https://doi.org/10.1109/TED.2023.3241834
- 10. Zhang C., Pan P., Cai J. et al. // IEEE Trans. 2023. V. ED-70. № 6. P. 2798. https://doi.org/10.1109/TED.2022.3233291
- 11. Yang R., Xu J., Yue L. et al. // IEEE Trans. 2022. V. ED-69. № 5. P. 2656. https://doi.org/10.1109/TED.2022.3161255
- 12. Рожнев А.Г., Рыскин Н.М., Каретникова Т.А. и др. // Изв. вузов. Радиофизика. 2013. Т. 56. № 8—9. С. 601.
- 13. Каретникова Т.А., Рожнев А.Г., Рыскин Н.М. и др. // РЭ. 2016. Т. 61. № 1. С. 54. https://doi.org/10.1134/S1064226915120116
- 14. Давидович М.В. // ЖТФ. 2019. Т. 89. № 2. С. 280. https://doi.org/10.21883/JTF.2019.02.47084.80-18
- 15. Shin Y.-M., Barnett L.R., Luhmann N.C. // IEEE Trans. 2009. V. ED-56. № 5. P. 706. https://doi.org/10.1109/TED.2009.2015404
- 16. Wang J., Shu G., Liu G. et al. // IEEE Trans. 2016. V. ED-63. № 1. P. 504. https://doi.org/10.1109/TED.2015.2502620
- 17. Srivastava V., Srivastava N. // 3rd Intern. Conf. and Workshops on Recent Advances and Innovations in Engineering (ICRAIE). Jaipur, India. 22–25 Nov. N.Y.: IEEE, 2018. P. 1. https://doi.org/10.1109/ICRAIE.2018.8710392
- 18. Srivastava V. // IETE Tech. Rev. 2018. V. 36. № 5. P. 501. https://doi.org/10.1080/02564602.2018.1509738
- 19. Zheng Y., Gamzina D., Himes L. et al. // IEEE 2020. V. THz-10. № 4. P. 411. https://doi.org/10.1109/TTHZ.2020.2995826
- 20. Nguyen K.T., Pasour J.A., Antonsen T.M. et al. // IEEE Trans. 2009. V. ED56. № 5. P. 744. https://doi.org/10.1109/TED.2009.2015420
- 21. Ruan C., Wang S., Han Y., et al. // IEEE Trans. 2014. V. ED-61. № 6. P. 1643. https://doi.org/10.1109/TED.2014.2299286
- 22. Navrotsky I.A., Burtsev A.A., Emelyanov V.V. et al. // IEEE Trans. 2021. V. ED-68. № 2. P. 798. https://doi.org/10.1109/TED.2020.3041425
- 23. Zheng Y., Gamzina D., Popovic B., Luhmann N.C. // IEEE Trans. 2016. V. ED-63. № 11. P. 4466. https://doi.org/10.1109/TED.2016.2606322
- 24. Yang L., Wang J., Li H., et al. // IEEE Trans. 2017. V. TPS-45. № 5. P. 805. https://doi.org/10.1109/TPS.2017.2688480
- 25. Zhang C., Pan P., Chen X. et al. // Electronics. 2021. V. 10. Р. 3051. https://doi.org/10.3390/electronics10243051
- 26. Yin P.C., Xu J., Yang R.C. et al. // IEEE Electron Device Lett. 2022. V. 43. № 8. P. 1343. https://doi.org/10.1109/LED.2022.3187160
- 27. Cook A.M., Joye C.D., Kimura T. et al. // IEEE Trans. 2013. V. ED-60. № 3. P. 1257. https://doi.org/10.1109/TED.2012.2232929
- 28. Сазонов В.П., Терехина З.Н., Лямзин В.М. // Обзоры по электронной технике. Сер. Электроника СВЧ. 1972. Вып. 3(8). С. 1.
